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作 者:李志军[1]
机构地区:[1]中国电子科技集团第三十八研究所表面处理分厂,安徽合肥230001
出 处:《电镀与涂饰》2015年第8期446-448,共3页Electroplating & Finishing
摘 要:以H2SO4 900 g/L、Na NO3 100 g/L和Na Cl 1 g/L体系为基础,通过添加整平缓蚀剂和黄烟(NO2)抑制剂,得到了一种操作简单、无黄烟、对基材低腐蚀的铜及铜合金光亮浸蚀新工艺。经过铜片出光效果及黄烟抑制试验,确定聚乙二醇为缓蚀剂、尿素为黄烟抑制剂,用量依次为3~5 g/L和5~10 g/L。研究表明,新工艺中氮氧化物释放量约为旧工艺的22.4%,浸蚀时间在10~120 s、空中停留60 s对试片外观无影响。该工艺适用于自动生产线操作。A novel bright pickling process for copper and copper alloys characterized by easy operation, yellow smoke-free, and low corrosion to the substrate was obtained by adding leveling corrosion inhibitor and yellow smoke(NO2) inhibitor to a bath containing 900 g/L H2SO4, 100 g/L Na NO3, and 1 g/L Na Cl. The polyethylene glycol was determined as corrosion inhibitor and urea as yellow smoke inhibitor through copper sheet bright dipping test and yellow smoke inhibition test. The dosage is 3-5 g/L for polyethylene glycol and 5-10 g/L for urea. It was found that the novel process reduces the release of nitrogen oxides by about 22.4% as compared with the previous one. The appearance of test coupon is slightly affected when pickling by the process for 10-120 s and staying in air for 60 s thereafter. The process is suitable for automatic production line.
分 类 号:TG178[金属学及工艺—金属表面处理]
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