液相化学还原法制备纳米银焊膏及其连接性  

Synthesis of Silver Nanoparticles Paste by Aqueous Reduction and Its Connectivity

作　　者：曹洋[1,2] 刘平 魏红梅[2] 林铁松[2] 何鹏[2] 顾小龙 

机构地区：[1]浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,杭州310030 [2]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《材料工程》2015年第4期79-84,共6页Journal of Materials Engineering

基　　金：国家自然科学基金资助项目(51275135;51321061)

摘　　要：采用液相化学还原法制备出平均粒径为20--35nm的纳米银,并考察不同温度及PVP用量对纳米银性质的影响。结果表明：当硝酸银与PVP的质量比为1∶4、反应温度为30℃时,纳米银的平均粒径最小,为22.4nm,且其团聚程度最小,粒径分布最佳。在压力10MPa、温度200℃、保温30min的烧结条件下,利用制得的纳米银配制焊膏,连接纯度为99.9%的无氧紫铜板,通过扫描电镜（SEM）观察烧结接头截面形貌,可见烧结界面连接紧密,接头组织有孔隙存在。Silver nanoparticles with average diameter of 20-35 nm were prepared by aqueous reduction method,and the influence factors of nanoparticles characteristics,such as reaction temperature and PVP concentration,were investigated during reduction process.The results show that monodispersity of nanoparticles is remarkably improved while unfavorable agglomeration is avoided with the AgNO3/PVP mass ratio of 1∶4at the reaction temperature 30℃,and the average diameter of silver nanoparticles reaches the mininum of 22.4nm.Copper pads with the purity of 99.9%are successfully bonded at200℃ and under the pressure of 10 MPa for 30 min,using sintering paste employing fresh silver nanoparticles.Morphology of the bonding joint is analyzed with scanning electron microscope（SEM）,the interface is compacted tightly and porous sintering characteristic is confirmed.

关 键 词：纳米银 液相化学还原法 低温连接 

分 类 号：TG425.1[金属学及工艺—焊接]