中温潜伏性固化剂在环氧树脂胶粘剂中的应用  

Application of moderate temperature latent curing agents in epoxy resin adhesives

作　　者：张梦玉[1] 齐暑华[1] 杨莎[1] 薛融[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《粘接》2015年第4期75-78,共4页Adhesion

摘　　要：在环氧树脂胶粘剂体系中,中温潜伏性固化剂以其优异的潜伏性和相对较低的固化温度而成为研究热点。综述了双氰胺、咪唑、有机酸酐和微胶囊近几年在环氧树脂体系中应用的最新研究进展。对环氧中温固化体系未来的研究方向进行了展望。The application of moderate latent curing agents in the epoxy resin adhesives has become the research hotspot for its excellent latency and relatively lower curing temperature. The research progress of application of dicyandiamide, imidazole, acid anhydride and microcapsules in the epoxy resin systems was introduced in detail. Finally, the future development of moderate temperature curing agents for epoxy adhesives was oudooked.

关 键 词：环氧树脂 中温潜伏性固化剂 促进剂 

分 类 号：TQ433.437[化学工程]