Thermal Physical Properties of Al-coated Diamond/Cu Composites  

作　　者：朱聪旭 ZHU Xuliang ZHAO Hongxiao FA Wenjun YANG Xiaogang 郑直 

机构地区：[1]Key Laboratory of Micro-Nano Materials for Energy Storage and Conversion of Henan Province, Institute of Surface Micro and Nano Materials, Xuchang University [2]State Grid Tianjin Electric Power Research Institute

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2015年第2期315-319,共5页武汉理工大学学报（材料科学英文版）

基　　金：Funded by the National Natural Science Foundation of China(21273192);the Foundation of He’nan Educational Committee(15B430009);the Key Scientific Research Foundation of Xuchang University(2014077)

摘　　要：To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.

关 键 词：diamond Cu thermal properties microstructures SPS 

分 类 号：TQ163[化学工程—高温制品工业] TB33[一般工业技术—材料科学与工程]