基于ANSYS有限元的Ag-Cu-Ti合金钎焊金刚石磨粒残余应力分析与优化研究  

Research on Thermal Stress of Brazed Diamond Grain with Ag-Cu-Ti Brazing Alloy Based on ANSYS

作　　者：朱迪[1] 吕明[1] 孟普[1] 

机构地区：[1]蚌埠学院机械与电子工程系,安徽蚌埠233030

出　　处：《盐城工学院学报（自然科学版）》2015年第1期39-42,共4页Journal of Yancheng Institute of Technology:Natural Science Edition

基　　金：国家级大学生创新创业训练计划项目(201311305016);安徽高等学校省级自然科学研究项目(KJ2013Z197)

摘　　要：研究金刚石包埋深度分别为20%、40%、50%、60%、80%的钎料对单层钎焊金刚石工具性能的影响。利用有限元软件ANSYS对Ag-Cu-Ti合金钎焊金刚石过程中形成的残余应力进行数值模拟,采用线性和静态的分析方法。研究结果表明,最大应力值位于金刚石和钎料界面结合处的最底部,应力从金刚石底部到顶部逐渐减小,金刚石受拉应力,钎料和工具基体受压应力。当金刚石的包埋深度介于20%与40%之间时,钎焊残余应力最小。The influence of the solder layer thickness to the properties of monolayer brazed diamond tools was studied.The embedding depth of diamond was 20%,40%,50%,60%,80%,respectively.When finite element software ANSYS was used to study the residual stress of diamond brazed with Ag-Cu-Ti alloy brazing,the brazing process could be thought as an isothermal process.Therefore the linear and static analysis method were used to research the residual stress formed during brazing process.Results show that the maximum stress appears at the interface between diamonds and brazing alloy,stress decreases from the bottom of the diamond to the top of the diamond; the diamond abrasive endures tensile stress,however,the brazing alloy and tools substrate endures compressive stress.When the embedding depth of the diamond is between 20% and 40%,the residual stress has the minimum value.

关 键 词：ANSYS 金刚石 残余应力 Ag-Cu-Ti合金 包埋深度 

分 类 号：TG74[金属学及工艺—刀具与模具]