灌封技术对MEMS高g加速度传感器性能影响研究  

Research on effect of encapsulation on performances of MEMS high-g acceleration sensor

作　　者：李策[1,2] 石云波[1,2] 刘欣[1,2] 

机构地区：[1]中北大学电子测试技术国家重点实验室,山西太原030051 [2]仪器科学与动态测试教育部重点实验室,山西太原030051

出　　处：《传感器与微系统》2015年第4期22-26,共5页Transducer and Microsystem Technologies

基　　金：国家自然科学基金资助项目(50535030)

摘　　要：针对恶劣环境下高频信号的干扰与由封装引起的结构失效,设计了一种MEMS高g加速度传感器,通过灌封实现机械滤波,保证封装的可靠性。根据传感器封装工艺,利用ANSYS软件建立有限元模型,仿真分析了灌封技术对传感器结构和性能。结果表明:灌封技术可提高传感器的高过载能力和输出灵敏度,灌封弹性模量相对较大、密度相对较小的灌封胶可提高传感器的高过载能力和灵敏度。Aiming at interference of high frequency signals in harsh environments and failures caused by package, design a high-g MEMS acceleration sensor which has high reliability by means of encapsulation. According to sensor packaging technology, use ANSYS software to establish finite element models, simulate and analyze structure and encapsulation techniques for sensor performance. The results show that encapsulation technology can improve overload capacity and sensitivity, that is to say, a relatively high elastic modulus and low density of the pouring sealant can be effective for the high-overload-resistance ability and high sensitivity of a MEMS high-g accelerometer.

关 键 词：高g加速度传感器 灌封 模态频率 灵敏度 高过载 

分 类 号：TN212[电子电信—物理电子学]