后摩尔时代雷达对抗装备集成化发展  

Radar Countermeasure Equipment Integration Development in The Age of Back-Moore

作　　者：金宝龙[1] 陈建平[2] 

机构地区：[1]中国电子科技集团公司第51研究所,上海201802 [2]海军驻上海地区电子设备军事代表室,上海201802

出　　处：《舰船电子对抗》2015年第1期40-43,共4页Shipboard Electronic Countermeasure

摘　　要：国际半导体技术发展路线图(ITRS)显示,遵循持续摩尔(More Moore)发展的数字集成电路、片上系统(SoC)和遵循超越摩尔(More than Moore)发展的多样化功能集成电路、系统级封装(SiP)是实现更高价值系统的双引擎。构成电子系统的多种功能模块均迎来了半导体集成工艺时代。提出电子系统来到了泛集成、后摩尔时代的概念,随后讨论了雷达对抗装备集成化发展趋势及几种主要的射频电路集成技术,提示了未来发展的重点。International technology roadmap for semiconductors（ITRS）shows that both digital integrated circuit（IC）and system on a chip（SoC）developed according to More Moore and the multi-function IC and system in package（SiP）development according to More than Moore are considered to be dual-engine to realize the system of higher value.Multi-function module used in the configuration of electronic systems is followed by the age of semiconductor integration technology.This paper presents the concept that electronic system comes to the age of extensive integration and Post Moore,then discusses the integration development trend of radar countermeasure equipment and several main radio frequency circuit integration technologies,prompts the emphasis of future development.

关 键 词：超越摩尔 雷达对抗装备 集成化 

分 类 号：TN974[电子电信—信号与信息处理]