挠性印制板的络合废水处理研究及应用  

Research on the treatment of complex wastewater of flexible printed boards and its application

作　　者：张永锋[1] 

机构地区：[1]中国工程物理研究院,四川绵阳621900

出　　处：《工业水处理》2015年第4期78-80,共3页Industrial Water Treatment

摘　　要：挠性印制电路板生产过程中产生的电镀混合废水是多种络合剂与铜、钯、铅、锡、氟等共存的络合废水,其形成的络合物很难除去。采用还原—凝聚共沉法对电镀混合废水进行处理,结果表明该方法处理多种络合剂共存的含铜、钯、铅、锡、氟等的电镀混合废水是切实可行的,取得了良好稳定的除铜及其他重金属的效果。The mixed electroplating wastewater from flexible printed circuit board production is the complex wastewater which consists of various complex agents coexisting with copper,palladium,lead,tin,fluorine,etc. This kind of complex is difficult to be removed. Reduction-coacervation coprecipitation method has been used for treating the mixed electroplating wastewater. The results show that this method for treating the electroplating wastewater which consists of various complex agents coexisting with copper,palladium,lead,tin,fluorine,etc. is feasible. Good and stable capacity for removing copper and other heavy methods can be obtained.

关 键 词：挠性印制电路板 电镀 络合废水 还原-凝聚共沉法 

分 类 号：X703.1[环境科学与工程—环境工程]