考虑温度效应的微操作平台的建模与性能分析  

Modeling and performance analysis of a micromanipulation stage considering temperature effects

作　　者：胡俊峰[1] 郝亚洲[1] 徐贵阳[1] 杨健[1] 

机构地区：[1]江西理工大学机电工程学院,江西赣州341000

出　　处：《工程设计学报》2015年第2期143-149,154,共8页Chinese Journal of Engineering Design

基　　金：国家自然科学基金资助项目(51265016);江西省自然科学基金资助项目(20122BAB216029)

摘　　要：微操作平台处于温度变化的工作环境中会产生热误差、断裂或疲劳破坏等意外情况．为了提高基于直梁式柔性铰链的微操作平台的精度，采用有限元方法建立考虑温度效应的平台热响应模型，并基于该模型对其热误差和热应力进行分析．采用欧拉‐伯努利梁模拟直梁式柔性铰链和杆件的力学行为，采用最小势能原理得到计入温度效应的微操作平台的力学方程．采用模态截断技术推导出温度变化与热误差、热应力之间的传递函数．以桥式微操作平台为算例分析温度变化对其性能的影响．分析结果表明：热误差对温度变化的灵敏度为0.192μm／℃，温度变化会产生较大的静态热误差；通过选择合理的结构参数可减小热误差；当单位温度变化时会产生0～0．21μm振动和11.6 M Pa的热应力，在动态热载荷作用下会产生较大的热振动和热应力．所以，不能忽略温度效应对微操作平台的影响，需要通过优化设计和热误差补偿策略减小其影响．The thermal errors ,fracture and fatigue will be occurred when micromanipulation stage are woking in environment with temperature changing .In order to improve the accuracy of a mi‐cromanipulation stage based on straight‐beam flexure hinges ,the finite element method was ap‐plied to build the thermal response model of the stage considering temperature effect ,and the thermal error and stress was analyzed according to the proposed model .Euler‐Bernoulli beam was adopted to simulate the mechanical behavior of the straight‐beam flexure hinge and links .The mechanical equations of the micromanipulation stage was obtained by using the principle of mini‐mum potential energy .The transfer function between the temperature change and thermal error , thermal stress was derived by using modal truncation technique .A typical bridge‐type microma‐nipulation stage was used as a example in order to analyze the effects of temperature change on the performance of the stage .The analytical results showed that the thermal error sensitivity to the change of temperature was 0.192 μm/℃ ,and the change of temperature would produce large static thermal error ;the thermal error could be reduced by choosing rational structure parame‐ters .The thermal vibration and stress was 0‐0.21 μm and 11.6 MPa ,respectively ,with a unit change on temperature .Large thermal vibration and stress would be occurred under dynamic thermal loads .In a word ,the temperature effects on the micromanipulation stage cannot be ig‐nored ,optimization design and the thermal error compensation strategy are needed to reduce the inf luence .

关 键 词：温度效应 微操作平台 有限元法 热变形 热应力 

分 类 号：TH112[机械工程—机械设计及理论]