Novel LDNMOS embedded SCR with strong ESD robustness based on 0.5 μm 18 V CDMOS technology  

Novel LDNMOS embedded SCR with strong ESD robustness based on 0.5 μm 18 V CDMOS technology

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作  者:汪洋 金湘亮 周阿铖 

机构地区:[1]Faculty of Materials, Optoelectronics and Physics, Xiangtan University [2]Hunan Engineering Laboratory for Microelectronics, Optoelectronics and System on a Chip

出  处:《Journal of Central South University》2015年第2期552-559,共8页中南大学学报(英文版)

基  金:Project(NCET-11-0975)supported by Program for New Century Excellent Talents in University of Ministry of Education of China;Projects(61233010,61274043)supported by the National Natural Science Foundation of China

摘  要:A novel LDNMOS embedded silicon controlled rectifier(SCR) was proposed to enhance ESD robustness of high-voltage(HV) LDNMOS based on a 0.5 μm 18 V CDMOS process. A two-dimensional(2D) device simulation and a transmission line pulse(TLP) testing were used to analyze the working mechanism and ESD performance of the novel device. Compared with the traditional GG-LDNMOS, the secondary breakdown current(It2) of the proposed device can successfully increase from 1.146 A to 3.169 A with a total width of 50 μm, and ESD current discharge efficiency is improved from 0.459 m A/μm2 to 1.884 m A/μm2. Moreover, due to their different turn-on resistances(Ron), the device with smaller channel length(L) owns a stronger ESD robustness per unit area.A novel LDNMOS embedded silicon controlled rectifier(SCR) was proposed to enhance ESD robustness of high-voltage(HV) LDNMOS based on a 0.5 μm 18 V CDMOS process. A two-dimensional(2D) device simulation and a transmission line pulse(TLP) testing were used to analyze the working mechanism and ESD performance of the novel device. Compared with the traditional GG-LDNMOS, the secondary breakdown current(It2) of the proposed device can successfully increase from 1.146 A to 3.169 A with a total width of 50 μm, and ESD current discharge efficiency is improved from 0.459 m A/μm^2 to 1.884 m A/μm^2. Moreover, due to their different turn-on resistances(Ron), the device with smaller channel length(L) owns a stronger ESD robustness per unit area.

关 键 词:LDNMOS embedded SCR TCAD simulation electrostatic discharge(ESD) robustness transmission line pulse(TLP) 

分 类 号:TN386[电子电信—物理电子学]

 

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