CCD图像传感器划片工艺优化  

Optimization of Dicing Process of CCD Image Sensor

作　　者：谷顺虎 王艳[1] 程顺昌[1] 陈于伟[1] 

机构地区：[1]重庆光电技术研究所,重庆400060

出　　处：《半导体光电》2015年第1期85-87,共3页Semiconductor Optoelectronics

摘　　要：针对某型CCD图像传感器划片过程中产生的静电损伤、崩边等缺陷造成器件失效,通过优化划片工艺条件,避免了静电损伤,减少了崩边缺陷,封装的成品率由48%提高至96%。ESD damage and chipping in the dicing process will result in the failure of CCD image sensors. Based on which, by the optimization of the dicing process, the ESD damage and die chipping were effectively decreased, and then the yield rate of package is improved from 48% to 96%.

关 键 词：CCD图像传感器 划片 崩边 静电损伤 优化 

分 类 号：TN305.1[电子电信—物理电子学]