QFN封装元件组装及质量控制工艺  

QFN Packing Device Assembly and Quality Control Process

作　　者：史建卫[1] 

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工业专用设备》2015年第2期21-30,共10页Equipment for Electronic Products Manufacturing

摘　　要：QFN封装由于具有良好的电和热性能、体积小、质量轻,在电子产品中被越来越广泛的推广和应用,针对QFN封装元件PCB焊盘设计、焊膏印刷网板开孔设计、贴装工艺、焊接工艺及返修工艺进行了阐述。QFN（Quad Flat No-Lead） Packing has been widely promoted and applied in the electronic products because of its good electronical and thermal performance, small volume and light weight. In this article, PCB pad design, stencil design for solder paste printing, component mounting process,reflow soldering and rework process of QFN packing device will be system exposited in detail.

关 键 词：QFN封装 热焊盘 网板设计 回流焊接 返修 

分 类 号：TN605[电子电信—电路与系统]