金刚石砂轮缓进给磨削单晶硅沟槽研究  

Grooving monocrystalline silicon plate using creep-feed grinding with diamond wheel

作　　者：艾小忱 董志刚[1] 周平[1] 康仁科[1] 陈晓[1] 郭东明[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024

出　　处：《金刚石与磨料磨具工程》2015年第2期26-32,共7页Diamond & Abrasives Engineering

基　　金：国家重点基础研究发展计划(973计划)课题(2011CB013201);国家高技术研究发展计划(863计划)课题(2013AA040104);"高档数控机床与基础制造装备"科技重大专项(20122X04003081-05);国家商用飞机制造工程技术研究中心创新基金项目(201301942)

摘　　要：分别选用2mm宽的树脂结合剂和金属结合剂金刚石砂轮,以缓进给磨削方式在单晶硅上进行开槽实验,研究砂轮类型、砂轮线速度、工作台进给速度等参数对沟槽加工质量的影响,同时探讨了表面陪片对提高磨削质量的作用。实验结果及分析表明:沟槽磨削质量与磨削参数和砂轮类型有关,与金属结合剂砂轮相比,使用树脂结合剂砂轮进行沟槽加工,单晶硅试样崩边尺寸较小,沟槽侧壁的表面质量较高;表面粘贴陪片后进行沟槽磨削可以显著降低沟槽两侧的崩边,提高磨削精度和效率。Several rectangular section grooves were cut on a polished surface of monocrystal silicon using creep feed grinding （CFG） with resin-bonded diamond wheels and metal bonded ones respectively. The effect of bond, wheel speed and table speed on surface quality was investigated. Experimental results demonstrated that the edge chipping size of the grooves was smaller and that the side wall quality ground with the resin bond wheel was better than that with the metal bonded grinding wheel. The edge chipping could be reduced significantly when the surface of the silicon to be ground was protected by a silicon cover.

关 键 词：单晶硅 缓进给沟槽磨削 金刚石砂轮 崩边 

分 类 号：TQ164[化学工程—高温制品工业] TG74[金属学及工艺—刀具与模具]