酸性硫脲浸出废旧手机线路板中金的研究  

Gold Leaching from Printed Circuit Boards of Discarded Mobile Phone by Acidic Thiourea

作　　者：白建峰[1] 白静[1] 王鹏程 王景伟[1] 张承龙[1] 苑文仪[1] 赵新 戴珏[1] 

机构地区：[1]上海第二工业大学电子废弃物资源化产学研合作开发中心,上海201209 [2]中国电器科学研究院,广东广州510300

出　　处：《矿冶工程》2015年第2期87-90,共4页Mining and Metallurgical Engineering

基　　金：国家自然科学基金项目(21307080);上海市教委创新重点项目(12ZZ194);广东省战略新兴产业项目(2012A032300017);上海第二工业大学重点学科建设项目(XXKYS1404)

摘　　要：采用硝酸氧化预处理-酸性硫脲浸金法浸出废旧手机线路板中金,考察了物料粒度、氧化剂Fe2(SO4)3质量分数、pH值、硫脲浓度、温度等因素对酸性硫脲浸金过程的影响,结果表明:物料粒度越小,金浸出率越高;当氧化剂Fe2(SO4)3用量0.3%、pH值1.5、硫脲浓度12g/L、温度30℃,磁力搅拌反应2h,金浸出率为88.54%。硝酸氧化预处理-酸性硫脲浸金工艺能高效、无毒地浸出手机线路板中的金,为"城市矿山"开采提供技术支撑。Gold leaching from printed circuit boards （PCB） of discarded cell phones was carried out via the process of nitric acid oxidation-acidic thiourea leaching, with the influences of particle size, mass fraction of ferric sulfate, pH value, thiourea concentration and reaction temperature on the leaching process investigated. The results show that the smaller the particle size, the higher the rate of gold leaching. Under the following conditions, including oxidant ferric sulfate dosage of 0.3%, pH value of 1.5, the thiourea concentration of 12 g/L, temperature of 30 ℃ and magnetic stirring reaction time of 2 h, the leaching rate of gold was 88.54%. It is concluded that the technique of pretreatment with nitric acid oxidation and leaching with acid thiourea is efficient and non-toxic for gold leaching, which can provide technical support for exploiting ＂urban mine＂.

关 键 词：硫脲 氧化剂 城市矿山 废旧手机线路板 金 浸出 

分 类 号：TF111[冶金工程—冶金物理化学]