低介电常数聚酰亚胺多孔薄膜的制备  

Preparation of Polyimide Porous Film with Low Dielectric Constant

作　　者：汪英[1] 周福龙 王汝柯 李耀星[1] 

机构地区：[1]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2015年第4期14-16,20,共4页Insulating Materials

基　　金：桂林电器科学研究院有限公司创新基金项目(12568)

摘　　要：以3,3′,4,4′-联苯四甲酸二酐和4,4′-二氨基二苯醚为单体,以三聚氰胺为成孔剂,制得一种聚酰亚胺多孔薄膜,并对薄膜的微观结构、力学性能及介电常数等进行测试。结果表明:制备该聚酰亚胺多孔薄膜的成孔工艺简单可行,三聚氰胺成孔剂可用热水溶解的方法去除。多孔薄膜孔洞数量多,且分布比较均匀。薄膜的介电常数较低、力学性能良好、吸湿率较低。当三聚氰胺添加量分别为25%和40%时,聚酰亚胺多孔薄膜的介电常数分别为1.82和1.36,聚酰亚胺多孔薄膜的拉伸强度分别为86 MPa和74 MPa,断裂伸长率分别为15%和10%。A polyimide porous film was prepared by using 3,3’,4,4’-biphenyltetracarboxylic dianhydride and 4,4’-diaminodiphenyl ether as monomer, melamine as pore-forming agent, and its microstructure, mechanical properties, and dielectric constant were tested. The results show that the pore-forming process of the polyimide porous film is simple and feasible, and the melamine can be dissolved by hot water. The porous films have a great number of pores and their distribution is uniform. And the porous poly-imide films have low dielectric constant, good mechnical properties, and low water absorption. When the melamine addition content is 25% and 40%, the dielectric constant of the porous polyimide film is 1.82 and 1.36, the tensile strength is 86 MPa and 74 MPa, and the elongation at break is 15% and 10%, respectively.

关 键 词：聚酰亚胺 多孔薄膜 成孔剂 介电常数 

分 类 号：TM215.3[一般工业技术—材料科学与工程]