氨性硫代硫酸盐体系中金溶解过程的腐蚀电化学行为  

An Corrosion Electrochemical Study on Leaching of Gold in Ammoniacal Thiosulfate Solutions

作　　者：许姣[1] 胡显智[2] 杨朋[2] 陈树梁 杨林秋 

机构地区：[1]昆明理工大学国土资源工程学院,云南昆明650093 [2]昆明理工大学理学院,云南昆明650093

出　　处：《昆明理工大学学报（自然科学版）》2015年第2期123-129,共7页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：国家自然科学基金项目(51064013);云南省自然科学基金项目(2011FB031);云南省教育厅基金重点项目(2001Z018)

摘　　要：为了研究氨性硫代硫酸盐浸金体系中金溶解过程的电化学行为,采用Tafel极化曲线分析法,考察了S2O2-3氨、Cu2+EDTA和CMC对金的腐蚀电位和腐蚀电流密度的影响.结果表明一定浓度的S2O2-3、氨、Cu2+和一定量的EDTA、CMC均使金的腐蚀电位(Ecorr)降低,表明金容易被溶蚀;腐蚀电流密度(Jcorr)增大,极化电阻(Rp)减小,表明金溶蚀速率加快.Electrochemical behavior and kinetics of gold dissolution in ammoniacal thiosulfate solutions are inves-tigated by Tafel polarization curve analysis.The effect of thiosulfate concentration,ammoniacal concentration, copper （Ⅱ ）concentration,ethylenediaminetetraacetic acid （EDTA ）concentration,carboxymethyl cellulose （CMC）concentration on the corrosion current density and corrosion potential is also investigated in this paper. The results show that the corrosion potential and resistance is decreased and the corrosion current density is in-creased when the thiosulfate concentration,ammoniacal concentration ,copper（Ⅱ）concentration,EDTA con-centration ,CMC concentration is kept in a certain level,which indicates that the dissolution rate of pure gold in the leaching system is enhanced.

关 键 词：硫代硫酸盐 浸金 Tafel 曲线 CMC EDTA 

分 类 号：TD953[矿业工程—选矿] TF831[冶金工程—有色金属冶金]