漆包线与铜箔的单面点焊工艺试验  

Analysis of indirect spot welding process test of enameled wire and copper foil

作　　者：李少哲[1] 李远波[1] 周磊磊[1] 郭钟宁[1] 

机构地区：[1]广东工业大学机电工程学院,广东广州510006

出　　处：《电焊机》2015年第4期26-31,共6页Electric Welding Machine

基　　金：国家自然科学基金资助项目(50775046);广东省微纳加工技术与装备重点实验室开放基金项目(GDMNML2013-05)

摘　　要：对0.1 mm漆包线和0.2 mm铜箔进行单面点焊试验。通过正交实验确定了焊接范围,再进行焊接电压的单因素实验。将接头拉断力和外观质量(包括焊接过程中的飞溅、氧化变黑现象、漆膜熔化状况、接头宽度、焊后结果检测)作为焊接性能评价指标。并从机理层次研究了焊接过程中接头的形成过程,同时进行金相试验。结果表明,随着焊接电压增加,接头宽度呈指数增加,接头漆膜宽度不断下降,接头的长度变化不明显,接头拉断力呈抛物线变化。在电镜观测下,漆包线和铜箔贴合面之间的结合线变化明显。A process test for indirect spot welding on 0.1 mm enameled wire to 0.2 mm copper foil is studied in this paper. The weldability range is determined by orthogonal experiment,and then the single factor experiment of welding voltage is made. The joint tensile strength and appearance quality（including spatter,oxidation and black phenomenon in welding,paint film melting condition,joint width,and test results after welding） are taken as the welding performance evaluation index. The formation process of joints in welding process is studied from the level of mechanism,meanwhile,the metallographic tests is performed. The results show that as the welding voltage increases,joint width raises exponentially,joint film width declines,welding voltage has no obvious effect on solder joint length,joint tensile strength shows parabolic change. In the electron microscope observation,the joint line between enameled wire and copper foil surface changes obviously.

关 键 词：焊接电压 金相试验 漆包线铜箔焊接 

分 类 号：TG453.9[金属学及工艺—焊接]