特殊IC板引脚焊点缺陷检测中景深的研究  

Research on the depth of field of soldering defect inspection for special integrated circuit units board

作　　者：许增朴[1] 王鑫[1] 王永强[1] 周聪玲[1] 

机构地区：[1]天津科技大学机械工程学院,天津300222

出　　处：《光学技术》2015年第3期261-264,共4页Optical Technique

摘　　要：检测具有特殊空间结构的IC板引脚焊点缺陷时,相机镜头相对于引脚平面会有一定的倾斜角度,在特定的范围内获取图像清晰,超过此范围图像出现离焦模糊。针对此问题进行了研究,建立了景深的数学模型,推导出合理拍摄角度的公式,并通过实验进行了分析和验证。Solder joint defects detection for circuit boards with special elevated electronic units, vision camera has to be placed at certain angle in order to get clear view of the board, but image gets blurred if the camera angle exceeds specific range. Aiming at the problem a mathematical model for depth of field is proposed and an image acquisition angle is found for best results. The method and results are verified through experiment.

关 键 词：机器视觉 焊点检测 景深 拍摄图像角度 

分 类 号：O439[机械工程—光学工程]