低介电常数聚酰亚胺材料制备方法研究进展  

Research Progress in Preparation Methods of Polyimide Materials with Low Dielectric Constant

作　　者：李子寓 寇开昌[1] 陈虹[1] 张宇[1] 王益群[1] 卓龙海[1] 

机构地区：[1]西北工业大学理学院陕西省高分子科学与技术重点实验室,西安710129

出　　处：《工程塑料应用》2015年第5期141-144,共4页Engineering Plastics Application

摘　　要：介绍了几种制备低介电常数聚酰亚胺(PI)材料的方法及其研究进展,包括引入氟原子降低极化率、引入硅氧烷增大自由体积、引入孔洞降低密度以及多种方法相结合共同降低介电常数等,指出了低介电常数PI制备方法的未来发展方向。Several preparation methods of polyimide（PI） materials with low dielectric constant and their research progress were introduced, which includes adding fluorine-containing groups to decrease the polarizability, adding siloxane to increase the free volume, adding holes to reduce the density and combining these methods to reduce the dielectric constant of PI and so on. The future development direction for preparing the PI materials with low dielectric constant was also pointed out.

关 键 词：低介电常数 含氟聚酰亚胺 硅氧烷 多孔聚酰亚胺 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]