观察裂纹路径及组织演变的SEM样品制备方法研究  

Study on SEM specimen preparation method for observation of crack path and microstructure development

作　　者：许天旱[1] 杨宝[1] 王党会[1] 

机构地区：[1]西安石油大学材料科学与工程学院,陕西西安710065

出　　处：《电子显微学报》2015年第2期163-168,共6页Journal of Chinese Electron Microscopy Society

基　　金：青年科技创新基金项目(No.Z12180);国家863计划资助项目(No.2006AA06A107);陕西省重点学科专项资金资助项目(No.ys32030203)

摘　　要：本试验利用SEM和电阻炉研究一种SEM样品的制备方法,用于观察裂纹路径,并分析断裂后的显微组织变化。结果表明:通过浸镀焊锡,能够在不同断裂方式形成的裂纹轨迹上形成一条明显的"纯锡带",呈现出裂纹路径。同时该方法能够观察分析拉伸、冲击、断裂韧性及疲劳断裂等过程中产生的二次裂纹路径及断裂表层下的组织演变。The SEM specimen preparation method was studied for observation of crack path and microstructure development by means of SEM and electric resistance furnace. The results show that by plating solder, the pure tin strip forms along the crack path which has already formed,so the crack path can be exhibited and observed. In the meanwhile, the method can be used to observe and analyze the secondary crack path and the microstructure development underneath the tensile, impact, fracture toughness and fatigue fracture surfaces.

关 键 词：SEM 浸锡 裂纹扩展路径 组织结构变化 纯锡带 

分 类 号：TG115[金属学及工艺—物理冶金]