稀释剂掺量对环氧树脂/低温固化剂体系固化动力学的影响  

Influence of diluent amount on curing kinetics of epoxy resin/low-temperature curing agent system

作　　者：崔东霞[1,2] 

机构地区：[1]山西省交通科学研究院,山西太原030006 [2]黄土地区公路建设与养护技术交通行业重点实验室,山西太原030006

出　　处：《粘接》2015年第5期61-64,68,共5页Adhesion

基　　金：山西省交通厅科研计划项目(编号:2014-1-7)

摘　　要：采用非等温DSC法对环氧树脂E-51/低温固化剂J005H-2/稀释剂692体系的固化反应动力学进行了研究。应用kissinger法和Flynn-Wall-Ozawa法计算得到了692不同掺量的E-51/J005H-2体系的固化反应动力学参数,并求得固化反应速率方程。结果表明,上述2种方法计算出的动力学参数相近,并验证了该体系符合n级反应模型原理。稀释剂的掺入以及掺量对整个体系的表观活化能有影响,稀释剂掺量为10%时,其活化能达到最低。低温固化剂体系的活化能与固化特征温度(初始、峰顶、完成)均低于常温固化剂体系,尤其是初始开始温度。The curing kinetics of epoxy resin E-51/low-temperature curing agent J005H-2/diluent 692 system was studied by non-isothermal different scanning calorimetry （DSC） .The curing kinetic parameters of the systems with different diluent 692 amount were calculated by Kissinger method and Flynn-Wall-Ozawa method. The curing reaction rate equations of above-mentioned systems were also obtained. The results showed that the kinetic parameters calculated by both the methods were similar, The curing reaction was consistent with the principle of n-th order reaction model. The usage and content of diluent692 had an impact on the activation energy. When the content is 10%, the activation energy touched the bottom .The characteristic temperatures （initial, peak, final） were all lower than those of normal temperature curing agent system, particularly the initial temperature.

关 键 词：稀释剂692 固化反应 活化能 DSC 低温固化剂 

分 类 号：TQ433.437[化学工程]