粉体化学镀镍液复合稳定剂的研究  

Study of Stabilizers on Electroless Nickel Solution for Powders

作　　者：马宝东[1] 邹忠利[1] 陈文豪[1] 杨世明[1] 

机构地区：[1]北方民族大学材料科学与工程学院,宁夏银川750021

出　　处：《广东化工》2015年第9期26-28,共3页Guangdong Chemical Industry

基　　金：大学生创新训练计划项目(QJCX-2013-001);宁夏高等学校科学研究项目(NGY2013090);北方民族大学科研项目(2012Y048)

摘　　要：文章分别考察了硫脲、碘化钾、乙酸铅和硫酸铜等四种稳定剂对粉体化学镀镍液稳定性和沉积速率的影响。实验结果表明:稳定剂的加入都可以改善镀液的稳定性,而对于镀液沉积速率而言,其加入量不是愈大越好,存在一个最佳的浓度范围。试验通过正交试验优选出既能使镀液稳定性良好,又有一定的沉积速率的复合稳定剂组成。试验结果显示,添加了复合稳定剂的化学镀液稳定时间达到3072 s,沉积速率为25.69μm/h。The paper investigates the effects of stabilizers on stability and deposition rate of electroless nickel bath for powder. Stabilizers include thiourea, potassium iodide, lead acetate and copper sulfate and other. Experimental results show that the addition of the stabilizer can improve the stability of plating bath. However, the adding amount of stabilizers is not the more the better; there exists an optimum concentration range for electroless deposition rate. Finally, the composite stabilizer was got by the tests which were optimized by orthogonal test. The stability of bath is good, and has the same rate of deposition rate. The results showed that addition of composite stabilizer made stability time reaches 3072 s, the deposition rate of 25.69 m/h.

关 键 词：化学镀镍 稳定剂 粉体 沉积速率 

分 类 号：TQ174.36[化学工程—陶瓷工业]