Cu包覆纳米Al_2O_3复合粉体的化学镀法制备  

Fabrication of Cu Coated Nano-Al_2O_3 Composite Powders by an Electroless Plating Method

作　　者：陆东梅[1] 王清周[1] 赵立臣[1] 杨瑞霞[1] 

机构地区：[1]河北工业大学,天津300130

出　　处：《稀有金属材料与工程》2015年第5期1259-1263,共5页Rare Metal Materials and Engineering

基　　金：河北省自然科学基金(E2012202015)

摘　　要：纳米Al2O3的力学性能优异,是一种理想的Cu基纳米复合材料的增强体,然而其与Cu基体的润湿性较差。为了改善其与Cu基体的润湿性,增强界面的结合力,通过化学镀工艺在其表面镀Cu,并采用SEM、TEM、XRD和EDS系统研究了镀液中络合剂及还原剂类型、镀液温度及施镀条件等重要因素对化学镀过程、镀膜质量的影响,进而优化了施镀工艺,获得了粒径均一、分散良好的Cu包覆纳米Al2O3复合粉体,为A12O3/Cu纳米复合材料的制备打下了良好的基础。Nano-Al2O3 is a promising reinforcing material of Cu based nano-composites due to its unique mechanical properties. However, the wetting property of Cu matrix and nano-Al2O3 is poor. The wetting property and the interfacial strength between nano-Al2O3 and Cu matrix would be improved through electroless plating a Cu film on nano-Al2O3 powders. Effects of key factors of complexing agent and reducing agent in bath, bath temperature and bath operating condition on the electroless plating process as well as the quality of the Cu film were studied by SEM, TEM, XRD and EDS. The plating process was then optimized, and the Cu coated nano-Al2O3 composite powders with uniform size and good dispersion were finally obtained. All these work will construct a steady base for the fabrication of A12O3/Cu nano-composites.

关 键 词：化学镀Cu 纳米AL2O3 双络合剂 还原剂 施镀条件 

分 类 号：TB33[一般工业技术—材料科学与工程] TB306