间位芳纶复合纸的界面性能研究  

Study on Interfacial Performance of Aramid Composite Paper

作　　者：孙召霞[1] 张素风[1] 豆莞莞[1] 

机构地区：[1]陕西科技大学轻工与能源学院陕西省造纸技术及特种纸品开发重点实验室,陕西西安710021

出　　处：《造纸科学与技术》2015年第2期41-44,共4页Paper Science & Technology

基　　金：陕西省西安市科技局技术转移促进工程项目(CX1256(8));陕西省造纸技术及特种纸品开发重点实验室访问学者项目(12JS024)

摘　　要：热压后,间位芳纶复合纸中纤维与浆粕间形成界面,而纤维与浆粕间的界面相容性直接影响着材料间界面的形态、结构、厚度,并最终决定着复合纸的性能优劣。本文主要采用SEM及TEM研究了两种国产间位芳纶复合纸的界面的表面性能,并对纤维与浆粕的溶解度参数进行了测定,采用红外光谱对界面进行了表征。Interface formed between the short fiber and fibrid of the meta - aramid composite paper was pressed, the interracial compatibility influenced the morphology, structure, thickness of interface in paper and determined the performance of the paper. SEM and TEM were employed in this article to study the interface of aramid paper. The solubility parameters of short fiber and fibrid were tested. The interface was represented by FFIR.

关 键 词：界面 相容性 SEM TEM 氢键 

分 类 号：TS756[轻工技术与工程—制浆造纸工程]