无溶剂复合技术的应用现状及展望  

The Application Status and Prospects of Solvent-free Composite Technology

作　　者：周黎丽 

机构地区：[1]黄山永新

出　　处：《包装前沿》2015年第3期20-21,共2页PACKAGING FOREFRONT

摘　　要：本文介绍了目前常用无溶剂复合设备的结构及常用胶水的优缺点，包括单组分胶粘剂、双组分胶粘剂（冷涂型与热涂型）、紫外线固化型单组分胶粘剂，同时对常用工艺及常见问题进行了分析。This article mainly introduces the structure of commonly used solvent-free composite device as well as the advantages and the disadvantages of the commonly used glue, including one-component adhesives, two-component adhesive （cold coating type and hot coating type ）, UV curing one-component adhesives, while the usual process and common problems were also analyzed.

关 键 词：无溶剂复合技术 单组分胶粘剂 展望 应用 双组分胶粘剂 复合设备 固化型 紫外线 

分 类 号：TQ433.437[化学工程]