中空玻璃珠/环氧树脂复合材料导热系数的有限元模拟  

Modeling of Thermal Conductivity of Hollow-Glass-Bead/Epoxy Resin Composite by Finite Element Method

作　　者：蒋潇[1] 贺铸[1] 高标[1] 蔡辉[1] 刘春欢[1] 许志安[1] 祝鑫阳 

机构地区：[1]武汉科技大学钢铁冶金及资源利用省部共建教育部重点实验室,武汉430081

出　　处：《机械工程材料》2015年第5期93-96,106,共5页Materials For Mechanical Engineering

基　　金：国家科技支撑计划项目(2011BAK06B02)

摘　　要：通过有限元模拟方法,用ANSYS软件建立了4种中空玻璃珠随机分布的中空玻璃珠(HGB)/环氧树脂复合材料的数学模型,计算得到了复合材料常温下的导热系数,并与文献中的试验结果进行了对比。结果表明:HGB的热绝缘效果非常显著,随着HGB体积分数增大,HGB/环氧树脂复合材料的导热系数线性减小,模拟结果与文献中的试验结果相符,证明了模拟结果的准确性。A mathematic model for four hollow-glass-bead（HGB）/epoxy resin composites with HGB random distribution was set up by finite element method using ANSYS software. The thermal conductivities of the composites at room temperature were calculated, and the predicted results were compared with the test results in some reference. The results show that the thermal insulation effect of HGB was remarkable. With the increase in volume fraction of HGBs, the thermal conductivity of HGB/epoxy resin composites linearly decreased. The predicted results in accordance with the experimental results in the relerence were proved to he accurate.

关 键 词：中空玻璃珠/环氧树脂复合材料 导热系数 有限元法 

分 类 号：TB332[一般工业技术—材料科学与工程]