汇流环技术的研究与发展  

Study and Progress of the Slip Ring Technology

作　　者：刘文科[1] 赵克俊[1] 郑传荣[1] 

机构地区：[1]中国电子科技集团公司第38研究所机电技术部,安徽合肥230088

出　　处：《电子科技》2015年第6期208-212,共5页Electronic Science and Technology

基　　金：国防技术基础计划基金资助项目(Z312012B001)

摘　　要：论述汇流环技术的研究进展。分析了汇流环的主要电性能指标,其中包括接触电阻、绝缘电阻、电介质强度、串扰、电噪声及驻波比等;针对汇流环电接触件结构、电接触材料及零部件制造工艺等方面的研究发展现状分别进行阐述;探讨了汇流环未来的发展方向:小型化、集成化以及向民用领域拓展。An overview on study and progress of the slip ring technology is presented. The main electrical per- formance parameters of the slip ring, including contact resistance, insulation resistance, dielectric strength, crosstalk, electrical noise and standing-wave radio are analyzed. The research status quos on electrical contact structure, electrical contact materials and manufacturing process of slip ring are introduced respectively. The future directions of slip ring, namely miniaturization, integration, and expansion into residential areas, are pointed out.

关 键 词：汇流环 电性能参数 接触电阻 发展 

分 类 号：TN911.7[电子电信—通信与信息系统]