热处理对片状银粉微观结构的影响  

Effect of Annealing on the Microstructure of Silver Flakes

作　　者：车龙[1,2] 堵永国[1] 杨初[3] 

机构地区：[1]国防科学技术大学,长沙410073 [2]中国空气动力研究与发展中心设备设计及测试技术研究所,四川绵阳621000 [3]第二炮兵装备研究院,北京100085

出　　处：《贵金属》2015年第2期33-37,43,共6页Precious Metals

摘　　要：通过高能球磨制备的片状银粉将产生大量的晶体缺陷,这些缺陷的存在将影响银粉的导电性能。对高能球磨制得的片状银粉进行了热处理研究,以减少或消除片状银粉内部的晶体缺陷,改善其微观组织,提高银粉的导电性。结果表明,热处理使塑性形变后的银粉发生回复和再结晶,晶格畸变和晶体缺陷明显减少或者部分去除。Silver flakes made by ball milling contain large quantities of crystal defects that have negative influences on the electric conductivity of silver powders. To decrease crystal defects, ameliorate the microstructure and improve the electric conductivity, an appropriate heat treatment was established in our work. The results indicated that annealing could make milled silver flakes recover and re-crystallize, resulting in the decrease and even elimination of these lattice distortion and crystal defects.

关 键 词：金属材料 片状银粉 球磨 热处理 晶体缺陷 

分 类 号：TG146.32[一般工业技术—材料科学与工程] TM241[金属学及工艺—金属材料]