低银Sn-0.45Ag-0.68Cu-X无铅钎料性能的对比研究  

Comparative Experimental Study on Performance of Low-silver Sn-0.45Ag-0.68Cu-X Lead-free Solder

作　　者：罗虎[1] 甘贵生[1] 王怀山[1] 孟国奇 王青萌 

机构地区：[1]重庆理工大学材料科学与工程学院,重庆400054

出　　处：《精密成形工程》2015年第2期51-54,65,共5页Journal of Netshape Forming Engineering

基　　金：重庆理工大学研究生创新基金(YCX2013101;YCX2014215);重庆理工大学科研启动基金(2012ZD12);重庆市教委/科技研究一般项目(KJ130813)

摘　　要：目的制备一种新型低银亚共晶Sn-0.45Ag-0.68Cu-X(SAC-X)无铅钎料,并对其综合性能进行探究。方法参照国家标准,对其漫流性、润湿性及力学性能进行了测试,并与Sn-37Pb,Sn-0.7Cu,Sn-3.5Ag-0.6Cu钎料进行了对比。结果 4种钎料漫流性和润湿性大小依次为:Sn-37Pb,Sn-3.5Ag-0.6Cu,SAC-X,Sn-0.7Cu,其中SAC-X钎料铺展率达78.5%,润湿时间为1.3 s,最大润湿力为3.18 m N;SAC-X钎料抗拉强度(40 MPa)与高银Sn-3.5Ag-0.6Cu钎料(44 MPa)相差不大,但延伸率是高银Sn-3.5Ag-0.6Cu的1.89倍。结论低银SAC-X钎料综合性能优良,与Sn-3.5Ag-0.6Cu钎料相差不大。A new type of low-silver hypoeutectic Sn-0.45Ag-0.68Cu-X （SAC-X） lead-free solder was prepared to in- vestigate its integrated performance. The flowing property, wettability and mechanical properties of the new type of solder were tested according to the national standards, and compared with those of Sn-37Pb, Sn-0.7Cu and Sn-3. SAg-0.6Cu solders. The flowing ability and the wettability of the four typical solders both followed the order of Sn-37Pb, Sn-3. SAg-0.6Cu, SAC-X and Sn-0.7Cu. The spreading rate of SAC-X solder reached 78.5% , the wetting time was 1.3 s, and the maximum wetting force was 3.18 mN. The tensile strength of SAC-X solder （40 MPa） was close to that of Sn- 3. SAg-0.6Cu solder （44 MPa）, but its elongation rate was 1.89 times that of Sn-3. SAg-0.6Cu solder. Low-silver SAC-X solder had good comprehensive performance, which was close to that of Sn-3.5Ag-0.6Cu solder.

关 键 词：低银SAC-X钎料 漫流性 润湿性 力学性能 

分 类 号：TG425[金属学及工艺—焊接]