间位芳纶纸板的制备及性能研究  

Study on Preparation and Properties of Meta-aramid Paperboard

作　　者：宋欢 刘卓峰[2] 白书欣[2] 周升 上官久桓 刘含茂 

机构地区：[1]株洲时代电气绝缘有限责任公司,湖南株洲412100 [2]国防科学技术大学航天科学与工程学院,长沙410073

出　　处：《绝缘材料》2015年第6期9-12,17,共5页Insulating Materials

基　　金：湖南省战略新兴产业项目(2012GK4077)

摘　　要：采用间位芳纶短切纤维和沉析纤维为原材料制备了芳纶纸板,分析了纤维配比、温度及压强对纸板电气强度及拉伸性能的影响,并对纸板金属离子含量、水浸液电导率和p H值、耐油污性能等进行了研究。结果表明:间位芳纶纸板最佳的纤维配比为短切纤维∶沉析纤维=5∶5,最佳工艺是热压温度280℃、热压压强8 MPa。间位芳纶纸板的综合性能达到国外同类产品水平,具有良好的应用前景。An aramid paperboard was prepared from meta-aramid short fiber and fibrid. The effects of the fiber ratio, temperature and pressure on the electric strength and tensile property of the paperboard were analyzed, and the metal ion content, electrical conductivity and pH value of infusion, and oil contamination resistance of the paperboard were studied. The results show that the optimal fiber ratio between meta-aramid short fiber and fibrid is 5： 5, and the optimal process is hot pressing temperature 280 ℃ and hot pressing pressure 8 MPa. The overall properties of the meta-aramid paperboard have reached the level of foreign similar product, and it has a good application prospect.

关 键 词：间位芳纶 纸板 电气强度 拉伸强度 

分 类 号：TM215.6[一般工业技术—材料科学与工程]