HEDP溶液体系电沉积铜的电化学行为  

Electrochemical behavior of copper electrodeposition in aqueous HEDP electrolyte

作　　者：韩姣[1] 曾振欧[1] 黄崴[1] 谢金平 范小玲 

机构地区：[1]华南理工大学化学与化工学院,广东广州510640 [2]广东致卓精密金属科技有限公司,广东佛山528247

出　　处：《电镀与涂饰》2015年第12期645-649,共5页Electroplating & Finishing

摘　　要：采用循环伏安曲线法和阴极极化曲线法研究了0.388 mol/L HEDP(羟基亚乙基二磷酸)+0.160 mol/L Cu SO4·5H2O溶液体系(p H=9.3或9.5)电沉积铜的电极过程动力学规律和添加剂对阴极极化的影响。结果表明,HEDP溶液体系电沉积铜是Cu2+的一步放电还原,遵循无前置化学转化反应或前置化学转化反应很快的不可逆电极过程动力学规律。添加剂HES(含硒无机化合物)和复配添加剂HES+HEA(多胺高分子聚合物)具有促进电沉积铜和抑制析氢的双重作用,提高了HEDP溶液体系电沉积铜的阴极电流效率。The electrode process kinetic law of copper electrodeposition from aqueous 0.388 mol/L HEDP （1-hydroxyethane-1,1- diphosphonic acid） ＋ 0.160 mol/L CuSO4·5H2O bath （pH = 9.3 or 9.5） and the effects of additives on the cathodic polarization were studied by measuring cyclic voltammograms and cathodic polarization curves. The results showed that the copper electrodeposition from HEDP bath occurs via a direct reduction reaction of cupric ion without other intermediates, following the kinetic law of irreversible electrode process without or with a rapid preceding chemical transfer reaction. Both additives HES （inorganic selenium-containing compound） and HES ＋ HEA （polyamine-type high-molecular polymer） have a dual function to promote copper electrodeposition and inhibit hydrogen evolution, resulting in the increase of cathodic current efficiency of copper electrodeposition in HEDP bath.

关 键 词：铜 电沉积 羟基亚乙基二磷酸 添加剂 动力学 

分 类 号：TQ153.14[化学工程—电化学工业]