ABS塑料表面镀铜工艺的研究  

Study of Copper Plating on ABS Plastic Surface

作　　者：陈尔跃[1] 杨晓超[1] 徐娟[1] 郭祥峰[1] 

机构地区：[1]齐齐哈尔大学化学与化学工程学院,黑龙江齐齐哈尔161006

出　　处：《电镀与精饰》2015年第6期1-5,9,共6页Plating & Finishing

基　　金：黑龙江省高校科研创新团队项目(项目编号2012TD012)

摘　　要：研究了温度、pH、缓冲剂以及搅拌方式对ABS塑料上化学镀铜沉积速率的影响。化学镀铜最佳条件为：在机械搅拌或者氮气搅拌下,θ为30-35℃,pH为11.0-11.5。利用X-射线衍射仪、光电子能谱仪和扫描电子显微仪分别对ABS塑料经过粗化、化学镀铜、电镀铜后的晶型结构、价态和表面形貌进行分析。价态分析表明,化学镀铜表面为Cu、CuO、Cu2O和Cu（OH）2;电镀铜表面为Cu、CuO。扫描电镜观察表明,化学镀铜可以将ABS塑料表面上大面积覆盖上铜,但存在少量孔道未被覆盖,电镀铜后ABS塑料表面完全被覆盖且结晶表面更致密均匀。In this paper, the effects of temperature, pH, buffering agent and stirring style on the deposition rate of Cu electroless plating on ABS plastic surface were studied. The optimal condition of Cu electroless plating was ： 0 30 - 35 ℃, pH 11 - 11.5 under mechanical or nitrogen stirring. Crystal structure, valence state and surface morphology of the ABS surface after roughening, Cu electroless plating and Cu electro-plating were analyzed by x-ray diffraction, photoelectron spectroscopy and scanning electron microscopy instruments respectively. The results of valence state analyzing showed that there were Cu, CuO, Cu2O, Cu（OH） 2 on the Cu electroless plated coating surface,and Cu, CuO on the Cu electroplated coating surface. The results of scanning electron microscopy observation showed that the ABS plastic could be covered with a large surface area of Cu by Cu electroless plating, but still a small number of pores couldnt be covered;and the ABS plastic surface could be completely covered with more compact and uniform crystalline surface after Cu electroplating.

关 键 词：ABS塑料 沉积铜 光电子能谱 电子显微镜 X-射线衍射仪 

分 类 号：TQ153.3[化学工程—电化学工业]