国产Ni-5%W合金基带电化学抛光工艺优化研究  

Study on the Electro-polishing Technique Optimization of Domestic Ni-5%W Substrate

作　　者：李志刚[1] 朱海[1] 韩坤[1] 韩婕[1] 吴向阳[1] 彭东辉[1] 徐静安[1] 

机构地区：[1]上海化工研究院,上海200062

出　　处：《电镀与精饰》2015年第6期6-9,共4页Plating & Finishing

基　　金：上海市科委科技攻关计划项目子项(11DZ1100303)

摘　　要：采用均匀实验设计方法,研究了Ni-5%W合金基带在磷酸-硫酸及添加剂体系中的电化学抛光工艺条件,利用DPS(Data Processing System)软件对抛光工艺进行逐步回归优化,同时根据回归后的特征方程组进行实验验证,并用金相显微镜、原子力显微镜对基带表面形貌进行表征。结果表明,通过两次回归拟合,在25μm×25μm范围内,基带表面均方根粗糙度可降低到3 nm以下,且实验值与预报值相对误差为2.36%。Ni-5% W substrates were electro-polished in the phosphoric acid- sulfuric acid and additives system with uniform design method, and that technique was optimized by DPS（ Data Processing System） software. At the same time, the experimental results were verified according to the regression equations. The surface topography of the suhstrates was characterized by means of metallographic microscope and AFM. The results showed that the root mean square roughness of polished substrate surface could be reduced to 3 nm or less within the range of 25μm×25μm by the two regression fitting, and the experimental values and the prediction relative error of 2.36%.

关 键 词：Ni-5%W合金基带 均匀设计 回归拟合 电化学抛光 

分 类 号：TG175.3[金属学及工艺—金属表面处理]