基于PFC3D的研磨片研磨过程离散元仿真  

Discrete element simulative analysis of lapping process on lapping film based on PFC3D

作　　者：应振根[1] 冯凯萍[1] 倪成员[1] 

机构地区：[1]衢州学院机械工程学院,浙江衢州324000

出　　处：《机电工程》2015年第6期757-761,767,共6页Journal of Mechanical & Electrical Engineering

基　　金：国家自然科学基金资助项目(51275272);衢州学院校基金项目(KY1304)

摘　　要：针对研磨片研磨过程中工件表面粗糙峰去除和研磨片磨粒涂覆层磨粒脱落的问题,将离散元技术应用到研磨片研磨过程微观表面变化研究中。以PFC3D软件为平台,对研磨片的研磨过程进行了建模与仿真,将模型简化为理想梯形凸起的粗糙峰层和磨粒-结合剂混合层的相互接触摩擦过程,通过双轴试验表征了模型微观参数,开展了单元接触点不平衡力的变化规律、单元脱落过程、磨粒涂覆层中结合剂结合强度以及砂结比对研磨过程的影响分析。研究结果表明,接触点处的不平衡力呈现散射样式逐步减弱,不平衡力峰值为5.9×103N;磨粒平行粘结强度为723 Pa,砂结比为1∶6时研磨效果最好,粗糙峰可以有效去除,表层钝化磨粒可以有效脱落。Aiming at solving the problems of the rough peak removing from the surface of the workpiece and the abrasive dropping off from the abrasives coating layer of the lapping film during the lapping process, the discrete element simulative analysis of lapping film lapping process was investigated. The lapping process of the lapping film and wprkpiece were modeled and simulated utilizing discrete element method based on PFC3D. The simplified model was contact friction process between the ideal trapezoidal convex asperity layer and the abrasive-binder mixing layer and the characterization of microstructure parameters was calculated by biaxial test, the variations of the unbalance force on the contact point, the process of element dropping, the influences of the bond strength of the binder and the abrasive-binder ratio on the lapping process were analyzed. The results indicate that unbalanced force on the contact point shows scattering style and gradually weakened, the peak value of the unbalanced force is 5.9×10^3 N, the good lapping effect is reached when abrasive parallel bond strength is 723 Pa and abrasive-blinder ratio is 1：6, as the rough peaks effectively remove and the blunt abrasives drop off.

关 键 词：研磨片 离散元 磨粒 粗糙峰 PFC3D 

分 类 号：TH161.1[机械工程—机械制造及自动化]