新型钛-铜基复合基体阳极的制备及性能研究  

Investigation on Fabrication and Properties of a Novel Ti-Cu Composited Substrate Electrode

作　　者：何远怀[1] 周生刚[1] 竺培显[1] 张瑾[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《昆明理工大学学报（自然科学版）》2015年第3期27-31,共5页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：国家自然科学基金项目(51074082);国家高新技术研究发展计划资助项目(2009AA03Z512)

摘　　要：引入铜金属作为基体组元来替代传统钛电极单一钛基体,借助扫描电镜及能谱仪研究Ti-Cu复合基的界面形貌及界面处元素分布,通过分析电极的线性扫描伏安（LSV）曲线,对比研究其涂层电极与传统钛涂层电极的电化学性能差异.研究表明：利用真空热压扩散烧结法可制备界面冶金式结合的Ti-Cu复合基材料,其界面的扩散反应和变化形式为：Cu＋2Ti→Cu Ti2,3Cu Ti2＋5Cu→2Cu4Ti3,Cu Ti2＋Cu4Ti3→5Cu Ti,Cu4Ti3＋8Cu→3Cu4Ti,Ti-Cu复合基涂层电极与传统钛涂层电极相比,其析氯电位负移40-90 m V,电极电催化活性提高.Cu is introduced as the substrate constituent to replace the single- titanium substrate in traditional titanium electrodes. The morphology and distribution of elements on Ti- Cu substrate interface are studied by scanning electron microscope and energy dispersive spectrometer. The different performances between the novel electrode and the traditional Ti coated electrodes are investigated by linear scanning voltammetry curves. The results show that the Ti- Cu composited substrate with metallurgical- type interface can be prepared by vacuum- pressing diffusion sintering. The diffusion reaction and change process of diffusion interface are Cu ＋ 2Ti → Cu Ti2,3Cu Ti2＋ 5Cu→2Cu4Ti3,Cu Ti2＋ Cu4Ti3→5Cu Ti,and Cu4Ti3＋ 8Cu →3Cu4Ti. Co MPared with those of traditional Ti coated electrode,the chlorine evolution potential of the novel composited electrode is lower by 40 ~ 90 m V and the electrocatalytic activity is higher.

关 键 词：真空扩散烧结法 Ti-Cu复合基 界面 电催化活性 

分 类 号：TB331[一般工业技术—材料科学与工程]