铜/活性炭—水分散体系稳定性研究  

Research on the Stability of the Aqueous Solution with Copper/Active Carbon

作　　者：李雪峰[1] 吴瀚森 李道金[1] 韩博[1] 谢沥丹 王守绪[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610054

出　　处：《实验科学与技术》2015年第3期217-219,共3页Experiment Science and Technology

基　　金：电子科技大学大学生创新基金资助项目

摘　　要：黑孔液是印制电路板孔金属化工艺的关键材料,其性能对最终孔金属化的质量有很大影响。文中介绍了一种新型铜/活性炭—水分散体系的制备方法,研究了体系的稳定性与导电能力。通过正交试验设计及数据分析,讨论了铜的相对含量、球磨时间、表面活性剂的相对含量等三个因素对体系稳定性的影响,并获得了试验的最优配方。研究结果表明,该体系可作为一种新型黑孔液应用。The black hole solution is a key material used in through hole and its performance has a great impact on the final quality.This described the preparation of the aqueous solution with copper/active carbon and researched on its stability and conductivity.Through the orthogonal experiment and data analysis,the discussed the impact of the relative content of copper,ball milling time,the relative content of surfactant these three factors on system stability and the optimal formula was gotten. The experiments result confirmed that this system can be used as a new type of black hole solution.

关 键 词：铜 活性炭 稳定性 正交试验 黑孔液 

分 类 号：TN405[电子电信—微电子学与固体电子学]