Mg-Si-Sn基热电器件电极材料的优化选择与连接工艺  

Optimization of Electrode Material and Connecting Process for Mg-Si-Sn Based Thermoelectric Device

作　　者：陈耿[1,2] 刘桃香[1,2] 唐新峰[2] 苏贤礼[2] 鄢永高[2] 

机构地区：[1]武汉理工大学材料科学与工程学院,武汉430070 [2]武汉理工大学材料复合新技术国家重点实验室,武汉430070

出　　处：《无机材料学报》2015年第6期639-646,共8页Journal of Inorganic Materials

基　　金：国家重大基础研究计划973项目(2013CB632502);国家自然科学基金(51402222;51172174;51401153);国家111计划(B07040)~~

摘　　要：研究了采用不同放电等离子烧结(SPS)工艺获得的单质金属(Ni、Cu、Ag、Al)电极与Mg-Si-Sn基热电材料结合界面的微观形貌和成分分布特征,测试了合金(Ni-Al、Cu-Al)、金属/合金复合电极材料的热膨胀系数、电导率和热导率等物性参数。实验结果表明:通过SPS烧结可以有效实现电极材料与Mg-Si-Sn基材料的连接,复合电极材料Ni-Al/Al(60:40)和Cu-Al/Cu(45:55)具有高的电导率和热导率,并且热膨胀系数与Mg-Si-Sn基热电材料相匹配,有可能成为Mg-Si-Sn基材料的较理想电极材料。Metal （Ni, Cu, Ag, A1） electrode was connected with Mg-Si-Sn based thermoelectric materials by Spark Plasma Sintering （SPS） process. Microstructure of interface, sintering process and transport properties, including elec- trical conductivity, thermal conductivity and thermal expansion coefficient, of electrode materials were investigated. The results showed that composites of Ni-A1/A1 （60：40） and Cu-A1/Cu （45：55） displayed high electrical conductivity, high thermal conductivity and suitable thermal expansion coefficient to Mg-Si-Sn based materials. It is indicated that the two composites have potential to be used as good electrode materials for, and to be connected by SPS sintering to, Mg-Si-Sn based materials.

关 键 词：镁硅锡 热电材料 电极材料 

分 类 号：TB34[一般工业技术—材料科学与工程]