铋酸盐玻璃/Mg_2SnO_4陶瓷复合材料结构与介电性能研究  

Structure and Dielectric Properties of Bismuth-based Glass/Mg_2SnO_4 Ceramic Composite Material

作　　者：周珏辉[1] 王睿[1] 张启龙[1] 杨辉[1] 

机构地区：[1]浙江大学材料科学与工程学院,浙江杭州310027

出　　处：《中国陶瓷工业》2015年第3期1-5,共5页China Ceramic Industry

基　　金：国家863计划项目(编号:2013AA030701)

摘　　要：使用固相法制备了铋酸盐玻璃/Mg2Sn O4陶瓷复合材料,研究复合材料相组成、微观形貌及其介电性能。研究表明:发现铋酸盐玻璃能够有效降低Mg2Sn O4烧结温度。当铋酸盐玻璃添加量为15wt.%以下时,复合材料为单相Mg2Sn O4,随着玻璃添加量的增加,陶瓷密度升高,介电常数上升同时介电损耗下降。而当铋酸盐玻璃添加量达到20 wt.%时,出现Bi2O3第二相,并伴随大量气孔,降低复合材料体积密度,破坏其介电性能。含15wt.%铋酸盐玻璃的复合材料在1350℃烧结获得最优介电性能:εr=7.74,Q×f=8800 GHz。Bismuth-based glass/Mg2SnO4 composite materials were prepared via solid-state route. Phase presence, microstructure and dielectric properties were studied. The sintering temperature of Mg2SnO4 ceramic can be obviously decreased by Bi-based glass. When the content of Bi-based glass is below 15 wt. %, spinel Mg2SnO4 is the only crystalline phase. And the density, dielectric constant and Q×f value increase with the increase of glass addition. However, when the addition of Bi-based glass reached 20 wt.%, second phase Bi203 appeared, which decreased the sintering density and deteriorated dielectric properties. Composite material with 15 wt.% of Bi-based glass sintered at 1350℃ shows good dielectric properties： εr = 7.74, Q×f= 8800 GHz.

关 键 词：复合材料 铋酸盐玻璃 液相烧结 介电性能 

分 类 号：TB332[一般工业技术—材料科学与工程]