集成式IGBT功率组件的现状及发展趋势  

Status and Development Trends of Integrated IGBT Power Assembly

作　　者：蒋云富 黄南[1] 袁勇[1] 陈燕平[1] 石廷昌 

机构地区：[1]株洲南车时代电气股份有限公司,湖南株洲412001

出　　处：《大功率变流技术》2015年第3期1-5,共5页HIGH POWER CONVERTER TECHNOLOGY

摘　　要：文章归纳了提高集成式IGBT功率组件集成度的3种技术手段,包括新型散热设计、新型封装与互联,以及驱动与控制高度集成。对现有技术流派分类剖析,探讨了集成式IGBT功率组件的发展趋势,涉及高智能化与PEBB模块化设计。It summarized three technical methods that could improve the integration level of integrated IGBT power assembly, which included the novel thermal design, packaging and interconnection and driver control circuit integration. The current technology classification was analyzed. Furthermore, the development trends of IGBT power assembly were discussed, including high intelligent design and PEBB module design.

关 键 词：IGBT 功率组件 集成 互联 散热 电力电子集成模块 智能化模块 

分 类 号：TN6[电子电信—电路与系统]