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机构地区:[1]沈阳理工大学装备工程学院,辽宁沈阳110159 [2]沈阳东基集团有限公司,辽宁沈阳110045
出 处:《粘接》2015年第7期32-36,共5页Adhesion
摘 要:用硫脲改性苯胺和己二胺,制备了一种新型环氧树脂固化剂。用涂膜硬度表征固化剂性能,对改性条件和环氧树脂固化条件进行了优化。结果表明,硫脲改性苯胺和己二胺的较佳工艺条件为苯胺/己二胺/硫脲物质量的比为0.08/0.12/0.10,于150℃苯胺与硫脲先反应2 h,再加入己二胺反应0.5 h。改性固化剂较佳固化条件为环氧树脂/固化剂质量比为100/20,先在60℃固化1 h,再在100℃固化1.5 h,或先60℃固化1 h,再在120℃固化1 h,涂膜硬度为0.785。A novel curing agent, thiourea modified, aniline and hexamethylene diamine was prepared. The performance of the curing agent was characterized with the film hardness and the optimal conditions of modifying and curing properties were studied. The results showed that the better modifying conditions were as follows: the mole ratio of aniline to hexamethylene diamine to thiourea was 0.08: 0.12: 0.10; after aniline with thiourea reacted at 150℃ for 2 h, hexamethylene diamine was put in and reacted at 150℃ for 0.5 h; the weight ratio of epoxy resin to curing agent was 100:20 ,after the resin was cured at 60℃ for 1 h and then cured continually at 100℃ for 1.5 h or at 120℃for 1 h, the hardness of cured resin film was 0.785.
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