Sn-0.7Cu-1In无铅钎料压入蠕变行为研究  

Study on Indentation Creep Behavior of Sn-0.7Cu-1In Pb-free Solder

作　　者：廖春丽[1] 刘光清[1] 张义[1] 

机构地区：[1]南充职业技术学院机电工程系,四川南充637000

出　　处：《铸造技术》2015年第5期1106-1108,1121,共4页Foundry Technology

摘　　要：采用自制的蠕变装置研究了Sn-0.7Cu-1In无铅钎料在不同温度和压力下的压入蠕变性能,利用SEM和XRD对合金蠕变前后微观组织进行观察和分析。结果表明,随温度或应力的增加,合金的蠕变速率增大。In的加入可以增大金属间化合物与液态钎料间的界面能,使平衡状态下Cu6Sn5晶粒长大受阻,抑制高温下β-Sn枝晶相的长大,对基体起到弥散强化和细晶强化作用,提高钎料的抗蠕变性能。The indentation creep behavior of Sn-0.7Cu-1In Pb-free solder was investigated at different temperature and compressive stress by SEM and XRD. The results show that the creep rate of the alloy increases with the increase of temperature and compressive stress. The interfacial energy between intermetallic compounds and liquid solder increases due to adding In, and the growth of Cu6Sn5 is blocked which hinders the deformation of the β-Sn. The indentation creep of Sn-0.7Cu-1In is greatly improved by dispersion strengthening and refined crystalline strengthening.

关 键 词：Sn-0.7Cu-1In合金 压入蠕变 微观组织 

分 类 号：TG425[金属学及工艺—焊接]