基于正交实验的H13模具钢半导体激光淬火工艺优化  

Process Optimization of Hardening on H13 Die Steel by Diode Laser Based on Orthogonal Experiment

作　　者：林继兴[1,2] 曹洪钢 牛丽媛[1] 童先[1] 李光玉[2] 王文权[2] 

机构地区：[1]浙江工贸职业技术学院材料工程系,浙江温州325003 [2]吉林大学材料科学与工程学院,吉林长春130025

出　　处：《应用激光》2015年第3期314-318,共5页Applied Laser

基　　金：温州市科技计划资助项目(项目编号:J20130007)

摘　　要：采用正交实验的方法,以半导体激光器对H13模具钢进行激光淬火,研究激光功率、扫描速度、搭接率等工艺参数对激光淬火后材料性能的影响,并对组织进行观察分析。结果表明,当激光功率为1 800 W,扫描速度为1 000mm/min,搭接率为40%时,H13钢表面硬化性能最佳,其表面硬度高达777.5HV0.2。According to the methods of the orthogonal experiment,H13 die steel was laser hardened by using a diode laser.The effect of process parameters on the property of materials after laser hardening was investigated,such as laser power,scanning speed,overlapping rate,etc.The microstructure was also observed and analyzed.The results show that H13 steel hardening surface get a optimum property at laser power of 1 800 W,scanning speed of 1 000 mm/min and overlapping rate of 40%.The surface hardness can reach up to 777.5 HV0.2.

关 键 词：H13模具钢 半导体激光器 激光硬化 正交试验 

分 类 号：TG156[金属学及工艺—热处理]