线列TDI型红外探测器组件坏元替代方法  

Alternative method of linear TDI infrared detector blind pixel

作　　者：郭亮[1] 李冬冰[1] 杨微[1] 石纲[1] 孙玉杰[1] 

机构地区：[1]华北光电技术研究所

出　　处：《激光与红外》2015年第7期809-813,共5页Laser & Infrared

摘　　要：国产线列TDI型红外探测器组件在红外系统中的应用越来越广泛,但由于加工材料和制造工艺等因素的影响,探测器组件存在坏元,将造成图像质量下降,图像灰度分布失真,进而影响红外系统的性能。本文介绍了576×6线列TDI型红外探测器组件的读出电路坏元替代方法,采用该方法可进行线列TDI型红外探测器组件通道内的坏元替代,提高图像质量。The linear TDI infrared detector is widely used in many fields. Due to the influence of some factors such as work materials and manufacturing process,there are blind pixels in infrared detector. Blind pixels will cause image degradation and the distribution distortion of image gray,which affects the performance of infrared system. An alternative method of blind pixel for 576 × 6 linear TDI infrared detector was introduced. Based on this method,blind pixels in channels of the linear TDI infrared detector can be replaced,which improves the image quality.

关 键 词：TDI 红外探测器 探测器盲元 

分 类 号：TN214[电子电信—物理电子学]