Effects of Al and N plasma immersion ion implantation on surface microhardness,oxidation resistance and antibacterial characteristics of Cu  

Al和N等离子浸没注入对铜表面硬度、氧化和抗菌性能的影响（英文）

作　　者：安全长[1,2,3] 冯凯[1] 吕和平[1] 蔡珣[1] 孙铁囤 朱剑豪[2] 

机构地区：[1]上海交通大学材料科学与工程学院上海市激光制造与材料改性重点实验室,上海200240 [2]香港城市大学物理与材料科学系,香港999077 [3]常州亿晶光电科技有限公司,常州213200

出　　处：《Transactions of Nonferrous Metals Society of China》2015年第6期1944-1949,共6页中国有色金属学报（英文版）

基　　金：Project(9231083) supported by Yunnan Aerospace Industry Corporation Contract Research,China;Project(9220061) supported by City University of Hong Kong Donation Research Grant,China

摘　　要：A1 and N were introduced into copper substrate using plasma immersion ion implantation （PIII） in order to enhance its hardness and oxidation resistance. The dosage of N ion is 5 × 1016 cm-2, and range of dosage of A1 ion is 5× 1016-2× 1017 cm-2. The oxidation tests indicate that the copper samples after undergoing PIII possess higher oxidation resistance. The degree of oxidation resistance is found to vary with implantation dosage of AI ion. The antibacterial tests also reveal that the plasma implanted copper specimens have excellent antibacterial resistance against Staphylococcus aureus, which are similar to pure copper.采用等离子浸没注入方法（PIII）将Al和N注入铜基体中,以提高铜的硬度和抗氧化性能。其中氮离子注入剂量为5×1016 cm-2,铝离子注入剂量范围为5×1016~2×1017 cm-2。氧化实验表明,铜的抗氧化性能随铝离子注入剂量变化;抗菌实验结果表明,对于金黄色葡萄球菌,等离子浸没注入的铜样品具有与纯铜同样优异的抗菌抑菌性能。

关 键 词：COPPER plasma immersion ion implantation NANOINDENTATION oxidation resistance antibacterial properties 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG174.4[金属学及工艺—金属材料]