新全板电镀线设备及药水测试技术探讨  

The new panel plating equipment and solution test technology

作　　者：陈少昌 

机构地区：[1]深圳市励高表面处理材料有限公司,广东深圳518000

出　　处：《印制电路信息》2015年第5期37-43,64,共8页Printed Circuit Information

摘　　要：文章通过讨论引进新的全板电镀线设备及药水测试两部分研究探讨,分析在采购设备和开线过程中需注意的细节和要点,清晰地指导电镀工程师顺利地完成开线工作。The paper discusses a new panel plating equipment and medicinal liquid in two-parts study to investigate test, makes analysis on the process of procurement of equipment and open lines which request to pay attention to the details and points. It provides a clear guidance to plating engineers successfully completed the opening line of work.

关 键 词：全板电镀 设备 药水 测试 

分 类 号：TN41[电子电信—微电子学与固体电子学]