CBGA器件组装工艺和焊接方法  

Assembly process and solder method of the CBGA device

作　　者：郭影[1] 

机构地区：[1]西安飞行自动控制研究所,陕西西安710065

出　　处：《印制电路信息》2015年第5期51-54,共4页Printed Circuit Information

摘　　要：BGA器件由于其独特的优越性得到了越来越广泛的应用。由于其节距越来越小,焊装难度越来越大,工艺要求也越来越高。由于其检测设备价格昂贵,使该类器件的焊接质量的检测相对困难,对BGA器件焊接的一次合格率要求很高,这就为焊接过程控制提出了更高的要求。本文就焊盘设计、焊膏量的控制、贴片精度要求、BGA器件焊接方法、温度曲线、焊接界面表面状态的选择等方面进行研究,阐述通过工艺控制来保证CBGA器件的质量与可靠性。The BGA components are widely adopted due to its unique superiority with the development of portability, miniaturization and high performance of modern electronic products. With smaller pitch,much more complicated soldering and assembling procedure, higher requirement of process, expensive inspection devices, the inspection of soldering quality is relatively difficult. The requirement of first-pass yield is extreme strict, which will set higher level of requirements for soldering process control. The pad design, control of solder paste quantity, requirement of handling accuracy, soldering method of BGA component, temperature curve, the selection of surface condition of soldering joints are studied, and guarantee of the quality and reliability of CBGA component by process control is described.

关 键 词：塑料封装BGA 组装工艺 焊接方法 

分 类 号：TN41[电子电信—微电子学与固体电子学]