大功率半导体直接输出激光加工系统开发  

Development of high power direct output semiconductor laser processing system

作　　者：胡晓冬[1,2] 徐元飞 姚建华[1,2] 于成松 

机构地区：[1]特种装备制造与先进加工技术教育部/浙江工业大学浙江省重点实验室,浙江杭州310014 [2]浙江工业大学激光加工技术工程研究中心,浙江杭州310014

出　　处：《红外与激光工程》2015年第7期1996-2001,共6页Infrared and Laser Engineering

基　　金：国家自然科学基金(51271170);国家国际科技合作项目(2011DFR71030);浙江省科技厅公益项目(2013C31012);浙江省重大科技专项重点工业项目(2012C11001)

摘　　要：半导体激光器及其工业应用是激光领域研究与发展的热点,国内大功率半导体激光器的发展已经取得了较大进展,但基于国产大功率半导体直接输出激光器的自动化加工装备研究较少。研制了国产大功率半导体直接输出激光加工系统,开发了基于DSP的嵌入式激光加工过程检测与控制系统,设计了用于该系统闭环温度控制的模糊控制算法,并取得了良好的温度控制效果。基于该平台开展了激光宽带相变硬化实验,实验表明:在温度控制模式下,相变硬化层深度和硬度的一致性要优于恒定功率模式。Semiconductor lasers and their industrial applications are research focus in laser field, the development of domestic high power semiconductor lasers has made great progress, but the research on automated processing equipment based on domestic high power semiconductor direct output lasers is few.A laser processing equipment was developed which was based on domestic high power direct output semiconductor lasers. DSP-based embedded control system was also developed for laser processing measurement and control, and fuzzy control algorithm was designed for closed-loop temperature control,and a desirable temperature control effect was acheved. Wideband laser transformation hardening experiments on this platform show that, the consistency of depth and hardness of the transformation hardening layer are better in the temperature control mode contrast to that in the constant power mode.

关 键 词：半导体激光器 加工系统 温度控制 激光相变硬化 

分 类 号：TN249[电子电信—物理电子学]