双配位体系化学镀Ni-P合金的研究  

Study on Electroless Ni-P Plating in Double Complexing System

作　　者：胡海娇[1] 刘定富[1] 

机构地区：[1]贵州大学化学与化工学院,贵州贵阳550000

出　　处：《电镀与环保》2015年第4期38-40,共3页Electroplating & Pollution Control

摘　　要：为了考察配位剂复配对化学镀镍的影响,在以LA为主配位剂的基础上,分别将LA与LB、乳酸、甘氨酸、苹果酸进行复配。固定LA的质量浓度为22g/L,改变第二种配位剂的质量浓度,研究配位剂复配对镀速、镀层中磷的质量分数、镀液稳定时间及镀层耐硝酸变色时间的影响。In order to investigate the influences of complexing agent compounding on electroless nickel plating, LA was selected as complexing agent, and it was respectively compounded with LB, lactic acid, malic acid and glycine. Influences of complexing agent compounding on the plating rate, phosphorus mass fraction in coating, bath stabilization time and coating nitric acid resistance discoloration time were investigated when LA mass concentration was at a constant value of 22 g/L and just change the mass concentration of the other eomplexing agent.

关 键 词：配位剂 复配 双配位体系 

分 类 号：TQ153[化学工程—电化学工业]