出 处:《China Petroleum Processing & Petrochemical Technology》2015年第2期9-16,共8页中国炼油与石油化工(英文版)
基 金:supported by the National Natural Science Foundation of China(51172285 and 51372277);the Fundamental Research Funds for the Central Universities(14CX02060A,15CX02084A);the Natural Science Foundation of Shandong Province(ZR2011EL030)
摘 要:In order to improve the thermal stability of condensed polynuclear aromatic(COPNA) resin synthesized from vacuum residue, 1,4-benzenedimethanol was added to cure COPNA resin. The curing mechanism was investigated by proton nuclear magnetic resonance spectrometry, solid carbon-13 nuclear magnetic resonance spectrometry and Fourier transform infrared spectroscopy. Microstructures of the uncured and the cured COPNA resins were studied by scanning electron microscopy and X-ray diffractometry. The thermal stability of COPNA resins before and after curing was tested by thermogravimetric analysis. The element composition of the cured COPNA resin heated at different temperatures was analyzed by an element analyzer. The results showed that the uncured COPNA resin reacted with the cross-linking agent during the curing process, and the curing mechanism was confirmed to be the electrophilic substitution reaction. Compared with the uncured COPNA resin, the cured COPNA resin had a smooth surface, well-ordered and streamlined sheet structure with more crystalline solids, better molecular arrangement and orientation. The weight loss process of the uncured and cured COPNA resins was divided into three stages. Carbon residue of the cured COPNA resin was 41.65% at 600 ℃, which was much higher than 25.02% of the uncured COPNA resin, which indicated that the cured COPNA resin had higher thermal stability.In order to improve the thermal stability of condensed polynuclear aromatic (COPNA) resin synthesized from vacuum residue, 1,4-benzenedimethanol was added to cure COPNA resin. The curing mechanism was investigated by proton nuclear magnetic resonance spectrometry, solid carbon-13 nuclear magnetic resonance spectrometry and Fourier transform infrared spectroscopy. Microstructures of the uncured and the cured COPNA resins were studied by scanning electron microscopy and X-ray diffractometry. The thermal stability of COPNA resins before and after curing was tested by thermo-gravimetric analysis. The element composition of the cured COPNA resin heated at different temperatures was analyzed by an element analyzer. The results showed that the uncured COPNA resin reacted with the cross-linking agent during the curing process, and the curing mechanism was confirmed to be the electrophilic substitution reaction. Compared with the un- cured COPNA resin, the cured COPNA resin had a smooth surface, well-ordered and streamlined sheet structure with more crystalline solids, better molecular arrangement and orientation. The weight loss process of the uncured and cured COPNA resins was divided into three stages. Carbon residue of the cured COPNA resin was 41.65% at 600 ℃, which was much higher than 25.02% of the uncured COPNA resin, which indicated that the cured COPNA resin had higher thermal stability.
关 键 词:condensed polynuclear aromatic resin SYNTHESIS vacuum residue CURING thermal stability
分 类 号:TQ320.1[化学工程—合成树脂塑料工业]
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