增强弹性缓冲材料在CCL层压制程中的应用  

Application on the enhanced-elastic buffer material in the process of CCL lamination

作　　者：周久红[1] 温振雄[1] 杨鑫[1] 翟俊威 

机构地区：[1]广东生益科技股份有限公司,广东东莞523808

出　　处：《印制电路信息》2015年第8期45-48,共4页Printed Circuit Information

摘　　要：随着PCB朝薄型化和线路精密化发展,基板要求越来越薄,同时基板可靠性要求越来越高,牛皮纸等传统缓冲材料已经无法完全满足其层压制程中对压力缓冲性的要求,文章主要研究在CCL层压制程中搭配使用增强弹性缓冲材料,以降低薄芯层压板缺陷率。With the development of PCB towards thinning and line-precision, substrate is required thinner and thinner, the reliability of substrate is requested higher, craft paper and other traditional buffer materials have been unable to meet the requirement for pressure buffer in the process of lamination, this paper mainly studies collocation in using enhanced-elastic buffer material in the process of CCL lamination, in order to reduce the defect rate of thin core laminate.

关 键 词：薄芯层压板 增强弹性缓冲材料 热塑性薄膜 纤维增强硅胶 

分 类 号：TN41[电子电信—微电子学与固体电子学]